The use of two-part (2K) adhesives, also known as reactive or structural adhesives, has advantages over one-part (1K) adhesives in production environments. But working with 2K materials can pose many challenges for manufacturers, especially for those who require precise mix ratios and output volumes.
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Which dispensing system is right for your application? Needle valve? Spool valve? Rotary auger valve?
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If the purpose of the underfill process is ultimately to increase the lifespan of a product, then shouldn’t manufacturers in the electronics industry seek out the best underfill dispensing systems they can find?
So, if we’re hoping to choose the best underfill dispensing system for printed circuit board assembly, what exactly are the factors to look for?
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Electrically conductive adhesives (ECA) continue to grow in use throughout the military and defense, aerospace and medical manufacturing industries for their electrical and thermal conductivity and their versatility as a bonding material. Let’s take a look at ECAs, the reasons to use ECAs, and the advantages of using a jet valve system for their application in electronics manufacturing
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A gasket is a mechanical seal between two or more flat surfaces (flanges), that fills the space between them. Gaskets are used to prevent leakage of liquids, gases, or debris into or out of the joined objects/parts. Manufacturers have left behind traditional die-cut peel-and-stick gaskets in large numbers, in favor of form-in-place (FIP) gaskets, from the automotive, medical, and electronics industries.
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It is estimated that roughly 90% of manufacturers have adopted jet dispensing for their underfill applications, taking advantage of the extreme dispensing speed of a jetting system.
If underfill dispensing speed is such a high priority, why wouldn’t operations make the switch to the fastest jet dispensing system available?
As PCBAs have become more tightly packed with through-hole components, bottom-side SMT devices, and ever more crowded circuitry, the precision of surface mount adhesive (SMA) dispensing is more critical than ever. But in the ever-competitive world of electronics manufacturing, precision is never enough. We need precision dispensing and ever greater speeds.
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The challenge of producing cutting-edge products like compact camera modules remains the same: how do operations maximize manufacturing speeds while ensuring product quality?
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Increase throughput and maximize accuracy with the fastest dispensing valve on the market.
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